Axiomtek CAPA55R 3.5" SBC with 11th Gen Intel Core i7/i5/i3 & Celeron, Triple Display

New Axiomtek CAPA55R Embedded  Board, 11th Gen Intel Core i7/i5/i3 & Celeron, LVDS, HDMI, DP++, GbE LAN & 2.5 GbE LAN
Model: CAPA55R
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Axiomtek CAPA55R 3.5” Embedded Board with HDMI, LVDS, DisplayPort++, 7 USB, GbE LAN & 2.5 GbE LAN

The 3.5" embedded board is created in an architecture of low power consumption with reliability required for various applications in rugged environments. The ZIO form factor is an integrated interface standard defined by Axiomtek and has been adopted as one of the specifications in the 3.5" embedded single board computers to meet concerns regarding insufficient expansion interfaces in small form factor (SFF) single board computers.

Featured here is the CAPA55R, a high-performance 3.5” embedded SBC powered by the 11th Gen Intel Core i7/i5/i3 & Celeron processors (Tiger Lake-UP3) with 28W cTDP and Intel Iris Xe Graphics. The industrial-grade embedded board features triple-display capability through HDMI 1.4, LVDS and DisplayPort++ interfaces, making it well-suited for graphics-intensive applications. This industrial motherboard is designed for operational stability with a wide operating temperature range from -20°C to +60°C. The CAPA55R is optimized for various industrial IoT-related applications in the embedded market, such as industrial control, machine vision, self-service terminal, digital signage, and medical imaging.

The feature-rich CAPA55R has two 260-pin SO-DIMM sockets for up to 64GB of DDR4-3200. To fully join the IoT world, this 3.5-inch SBC is equipped with one M.2 Key E slot (PCIe x1, USB 2.0 in 22 x 30) for wireless modules, one M.2 Key B (PCIe x1, USB 3.2 gen2, USB 2.0 in 30 x 42 or 30 x 50) slot for cellular network cards such as 4G/LTE/5G modules, and one pin-header SIM connector to expand the SIM socket with the AX93A19 module. Keeping up with the fast transmission of massive data, it also has one M.2 Key M (PCIe x4, 22 x 80) for NvME storage cards. To satisfy the increasing demands of connecting more peripheral devices, the CAPA55R also provides three USB 3.2 Gen2, four USB 2.0, one GbE LAN, one 2.5 GbE LAN, two RS-232/422/485, one SATA-600, 8-channel DIO, and one HD audio via the daughter I/O board AX93A22. In addition, the 3.5-inch embedded SBC provides a 12-24 VDC input. It supports Windows 10 and Linux operation systems.

The highly integrated CAPA55R offers up to 64GB DDR4, 4K HDMI, 2.5 GbE LAN, three M.2 slots, and up to seven USB ports. This compact embedded board is ideally suited to embedded solutions requiring multi-tasking capabilities and full-graphics feature. Its reversed onboard CPU is attached on the rear side of the board to aid with heat dissipation and offers flexibility for easy system integration, especially in space constraint enclosure. The CAPA55R was designed to shorten the time to market and reduce development costs.

Key Features
  • 11th gen Intel Core i7/i5/i3 & Celeron processor
  • Two DDR4 SO-DIMM for up to 64GB of memory
  • One GbE LAN and one 2.5 GbE LAN ports
  • Three M.2 expansion slots
  • Available with fan or heatsink
Configurations

CAPA55RPHGG-i7-1185G7E W/FAN, 3.5" Embedded SBC with Intel i7-1185G7E Processor, DDP/HDMI/LVDS, dual LANs, 7 USB and fan
CAPA55RPHGG-i5-1145G7E W/FAN, Same as above with Intel i5-1145G7E Processor
CAPA55RPHGG-i3-1115G4E W/FAN, Same as above with Intel i3-1115G4E Processor
CAPA55RPHGG-CELERON-6305E W/FAN
, Same as above with Intel Celeron 6305E Processor

CAPA55-i7-1185-H, 3.5" Embedded SBC with Intel i7-1185G7E Processor, DDP/HDMI/LVDS, dual LANs, 7 USB and heatsink
CAPA55-i5-1145-H, Same as above with Intel i5-1145G7E Processor
CAPA55-i3-1115-H, Same as above with Intel i3-1115G4E Processor
CAPA55-6305E-H
, Same as above with Intel Celeron 6305E Processor

Accessories Available (Call for pricing)
  1. SIM card slot board
  2. HD codec audio board for Mic-in/Line-in/Line-out
  3. 2 USB 2.0 wafer cables w/bracket, 180 mm
  4. COM port cable DB-9 x 1P, P=1.25 mm, L=250 mm
  5. Buzzer cable 9 x 5.5 mm 2-pin, L=40 mm
  6. USB 3.0 cable 20P to USB type-A/FE*2, L=40 mm
  7. CAPA55R heat spreader

Customize your CAPA55R 3.5" Embedded Board by calling us today. Our industrial computing and IoT networking devices improve every facet of your operation. Saving you time and money is our business. Contact Westward Sales to learn more.

Technology
CategoryIndustrial Motherboard
Computing
CPUIntel Core i9/i7/i5/i3 | Intel Celeron
CPU ChipsetSoC Integrated
Maximum System Memory64 MB
System Memory Configuration2x 260-pin dual-channel DDR4-3200MHz SO-DIMM, up to 64GB
BIOSAMI
Expansion Slots1x M.2 Key E (PCIe x1, USB 2.0 in 22 x 30), 1x M.2 Key B (PCIe x1, USB 3.2 Gen2, USB 2.0 in 30 x 42 or 30 x 50), 1x SIM connector via pin header
Watchdog Timer65536 levels, 1 to 65535 sec.
Video
Display Type1x HDMI 1.4, 1x LVDS; 18/24-bit single/dual channel, 1x eDP (optional), 1x DisplayPort++
Interfaces
USB4x USB 2.0, 3x USB 3.2 Gen2
AudioHD Audio link via pin header
Battery
Battery TypeLithium 3V/220mAH
Power
Input Voltage1 x DC Jack, 12V to 24V DC in, AT Auto Power On function supported
Mechanical
Dimensions146 x 104 mm, 1.6 mm thick
Ratings
Operating TemperatureFan: 0°C to 60°C (32°F to 140°F), Heatsink: -20°C to 60°C (-4°F to 140°F)
Humidity10 to 95% non-condensing